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Products application

Thin film photovoltaic
Flat display industry
Low-e glass industry
Optical coating industry
Tools coating industry
Semiconductor industry
Rare-Earth Permanent industry
Electrochromis industry

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Semiconductor produce process include crystal circle making,crastal circle testing,chip packing and ending test .after encapsulation,its need a series of other process.such as:Post Mold Cure、Trim&Form、Plating and printing process etc. Typical encapsulation process is scribing/Loading/ bonding/Sealing/edging / electroplating/printing/ tendon-cut and molding/ inspection/testing/shipping.In the whole manufacturing , sputtering process was existed in Crystal making and chip packaging.

APG in Semiconductor indusrty to provide target material basically has:

Type	ltem	Descripetion	Purity	Technology
Purity-Targets	Cu	acc. your require	99.99%	melting
	Ti		99.99%	melting、CIP
	W		99.99%	sintering、HIP
	SS			melting
	Al		99.99%	melting
	Si		99.99%	pulled crystal+spraying+sintering
	Mo		99.99%	sintering
	Cr		99.99%	HIP、spraying
	Ta		99.99%	melting
	Ag		99.99%	melting
	Pt		99.9%	melting
	Ir		99.99%	melting
	Sc		99.95%	melting
	In		99.99%	cast
Aolly-Targets	AlSc		99.8%-99.99%	sintering
	NiFe		99.9%-99.999%	spraying
	NiCr		99.95%	melting、spraying
	NiCu		99.95%	melting
	NiV		99.95%	melting
	WTi		99.9%	melting、spraying
Evaporation material	Cu、Ti、W、Al、Mo、Cr、Ta、Ag、Au、Pt、Ir、Y